Commits
dingtianhong committed 834db4bcdf9
bonding: ust micro BOND_NO_USE_ARP to simplify the mode check The bond 3ad and TLB/ALB has the same check path, so combine them. Signed-off-by: Ding Tianhong <dingtianhong@huawei.com> Signed-off-by: David S. Miller <davem@davemloft.net>